About BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V., through its subsidiaries, engages in the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry. The company manufactures semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. The company’s equipment and integrated systems are used to produce semiconductor assemblies or ‘packages’, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. The company’s products are used to assemble chips for various end-use applications including electronics, computer, automotive, industrial, RFID (Radio Frequency Identification Device) and solar energy. Product groups Die bonding equipment: It includes single, multi-chip and flip chip die bonding systems which place the chip onto a multi-layer substrate; and Die sorting systems, which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations. Packaging equipment: It consists of molding systems that encapsulate bonded semiconductor devices in epoxy resin; Trim and form systems used to cut and then form metallic leads of encapsulated semiconductor devices in leadframe applications; and Singulation systems used to cut packaged array connect devices. Plating equipment: It consists of automated tin plating and spot plating systems for conventional leadframe applications; and antenna plating systems for new RFID and thin film solar cell applications. Customers The company’s customers are primarily the U.S., European, and Asian semiconductor manufacturers, assembly subcontractors and electronics and industrial companies, including Amkor, ASE, Epcos, Fairchild, Infineon, Osram, UTAC, STATS ChipPac, Samsung, Siliconware, SPIL and STMicroelectronics and Texas Instruments. Significant Events In October 2020, BE Semiconductor Industries N.V. entered into an agreement with Applied Materials, Inc. to develop an equipment solution for die-based hybrid bonding, a chip-to-chip interconnect technology that enables chip and subsystem designs for applications, including high-performance computing, AI, and 5G. History BE Semiconductor Industries N.V. was founded in 1995.